How can we help?

Silicon Insight have been working hands-on with semiconductor devices since 2003

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We have significant expertise in the following disciplines:

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• Scanning Electron Microscopy (SEM)

• Focused Ion Beam (FIB) for cross-sectioning or (S)TEM sample preparation

• Broad Beam Ion Milling (BBIM or BIB) for semiconductor cross-sectioning or deprocessing

• Mechanical polishing techniques for semiconductor cross-sectioning, delayering or backside thinning

• Wet chemical techniques for semiconductor decapsulating (depackaging) and deprocessing

• Wire bonding and repackaging of semiconductor devices

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We can assist in sourcing instrumentation, bespoke training and process development in all the techniques mentioned above